Press Releases

SMT 256EP New High Viscous Solder Joint Encapsulant Adhesive Paste

SMT 256EP, an innovative solder joint encapsulant adhesive paste designed for mass production via dispensing or printing.

SMT 88UH Fast Cure, Reworkable Underfill

YINCAE's room-temperature underfill that is easily reworkable and has the advantage of a fast-cure time.

BP 256 Ball Attach Adhesive

YINCAE's Ball Attach Adhesive that enhances solder joint reliability and eliminates cleaning processes for LEAD-FREE ball bumping procedures.

SMT 88UL Super-Fast Flow Room Temperature Underfill

YINCAE's next generation, super-fast flow, room temperature underfill.

SMT 158UL Highly Filled Room Temperature Underfill

SMT 158UL, an innovative, highly filled capillary underfill designed for the microelectronics industry.

DA 90 Low Temperature Die Attach Adhesive Series Materials

YINCAE's new low temperature die attach adhesives that offer conductive and insulating options to suit a large variety of applications.

YINCAE’S New Molded Underfill: MUF 158

YINCAE Advanced Materials has recently developed a unique mold encapsulant: MUF 158.

YINCAE’S New Reflowable Underfill Materials: SMT 158R & SMT 160

Two new reflowable (no-flow) underfill materials, SMT 158R and SMT 160, designed to simplify the assembly process and reduce costs.

DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

YINCAE’s new fast curing die attach adhesives that offers conductive and insulating options to suit a large variety of applications.

Innovation At Its Best

Engineering Materials for Micro-Chip Applications