Press Releases

YINCAE’S New Reflowable Underfill Materials: SMT 158R & SMT 160

Two new reflowable (no-flow) underfill materials, SMT 158R and SMT 160, designed to simplify the assembly process and reduce costs.

DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

YINCAE’s new fast curing die attach adhesives that offers conductive and insulating options to suit a large variety of applications.

YINCAE’S New Reflowable Underfill Material: SMT 160

SMT 160, a reflowable (no-flow) underfill designed to streamline the assembly process and increase production throughput.

Low Temperature Reflowable Underfill Material: SMT 160L

SMT 160L, a low-temperature curable, reflowable (no-flow) underfill designed to simplify the assembly process and increase throughput.

YINCAE’S New Highly Conductive Thermal Underfill: SMT 158D

SMT 158D, the world's first and only diamond-filled underfill material with superior thermal conductivity.

YINCAE’S SMT 158A Receives High Praise

SMT 158A underfill has received high praise for its thermal performance, specifically in challenging environments like automotive applications.

YINCAE’s New Underfill with Zero Outgassing: SMT 158HA

SMT 158HA, a high-performance underfill characterized by zero outgassing and full compatibility with flux materials.

YINCAE’s New NC 256 Zero Residue Flux

YINCAE's No Clean Flux Product with excellent soldering wetting, and that eliminates the cleaning process.

Fully Flux Residue Compatible, Room Temperature Fast Flow, Reworkable Underfill SMT 88UL2

SMT 88UL2, a high-performance underfill designed to solve long-standing compatibility issues between underfills and flux residues.

Innovation At Its Best

Engineering Materials for Micro-Chip Applications