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Press Releases
YINCAE's DA 158N Die Attach Material that can withstand -273℃
Thermally conductive, electrically insulating Die Attach material that can be cured at low temperatures.
YINCAE’s Fully Flux Residue Compatible Underfill: UF 158HA
UF 158HA, a high-performance underfill that is fully compatible with flux residue.
YINCAE Launches Breakthrough Thermal Underfill: UF 158A2
UF 158A2, a breakthrough thermal underfill designed to improve thermal management and structural integrity for electronic components.
YINCAE Launches UF 66L Optical Clear Underfill for High-Reliability Silicon Photonics and Optoelectronic Packaging
UF 66L, a next-generation Optical Clear Underfillspecifically engineered for high-reliability applications including silicon photonics, optoelectronic packaging, image sensors, AR/VR modules, and advanced flip-chip assemblies.
YINCAE Launches Snap Cure, Highly filled, 100% No-Clean Flux Residue Compatible Underfill: UF 120HA
UF 120HA, an innovative underfill material designed for high-throughput manufacturing applications.
YINCAE Launches Next Generation Solderable Adhesives: EN 256ED
Next-generation solderable adhesive that combines soldering and encapsulation into a single process.
TM 230D Introduced: Innovative 3-in-1 Solderable Adhesive
TM230D, an innovative 3-in-1 sintering material designed for high-performance semiconductor and power electronics applications.
Innovation At Its Best
Engineering Materials for Micro-Chip Applications
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