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Advanced Materials Driving Next-Gen Semiconductors

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UVC 88F
Highly fluorescing, one-part, 100% solid, dual cure acrylated polyurethane flexible Conformal Coating
110
Dispensing
Dipping
Spray
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UVC 88G
Highly biocompatible, one-part, 100% solid, dual cure acrylated polymer flexible hydrogel coating
110
Dispensing
Dipping
Spray
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UVC 88P
Highly fluorescing, one-part, 100% solid, dual cure acrylated polyurethane flexible Conformal Coating
110
Dispensing
Dipping
Spray
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
WCP 45
zero VOC, aqueous polymer coating
25
Spray
Dipping
Spin Coat
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
WH 66O
-40°C.
One-part, 100% solid, dual cure, UV bonding adhesive designed for wafer-level lens or optical lens attachment
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
WL 66C
- 20°C.
One-part, 100% solid, dual cure, UV bonding adhesive designed for wafer-level lens or optical lens attachment
Dispensing
Printing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
WL 66H
-20°C.
One-part, 100% solid, dual cure, low thermal cure, Wafer-Level Die Attach adhesive designed for wafer-level or optical lens attachment
100
Dispensing
Printing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
WL 66L
- 20°C.
One-part, 100% solid, dual cure, UV bonding adhesive designed for wafer-level lens or optical lens attachment
Dispensing
Printing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
WL 66O
- 20°C.
One-part, 100% solid, dual cure, UV bonding adhesive designed for wafer-level lens or optical lens attachment
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
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Engineering Materials for Micro-Chip Applications