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Advanced Materials Driving Next-Gen Semiconductors

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UF 158D
-40°C.
Fast-flow, easily reworkable, thermal diamond underfill
130
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UF 158EN
-40°C.
Fast-flow, low-temperature, slow cure and high purity liquid epoxy underfill
175
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UF 158HA
-40°C.
Flux-compatible, high performance, reflowable Underfill with no resin bleed
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UF 158LA
- 40°C.
Fast-flow, low-temperature, slow cure and high liquid epoxy underfill
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UF 158UL
-20°C.
Super fast-flow capillary underfill that can flow into a 10μ gap at room temperature without preheating
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UVA 88A
Below 25°C.
Dual cure, UV adhesive designed for optical device bonding
110
Dispensing
Telecommunications
Aviation
Defense
UVA 88C
Below 25°C.
Corner bond and underfill replacement that is void free after cure
110
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UVA 88E UV
Below 25 °C.
Dual cure, UV adhesive designed for LED and area image sensors
110
Dispensing
Telecommunications
Aviation
Defense
UVC 88B
One-part, 100% solid, dual cure, highly biocompatible, polymer flexible coating
110
Dispensing
Dipping
Spray
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
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