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All Products
TM 230
Rapid cure, self-filling, self-leveling, and self-soldering adhesive
230
Dispensing
Automotive Electronics
Aviation
Consumer Electronics
Defense
Medical Devices
Telecommunications
Solar Energy
TM 230D
Rapid cure, self-filling, self-leveling, and self-soldering adhesive
Dispensing
Automotive Electronics
Aviation
Consumer Electronics
Defense
Medical Devices
Solar Energy
Telecommunications
UF 66L
below -20 °C
One-part, solid, dual-cure, UV opitcal underfill
120
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UF 88UH
Super-fast curing adhesive that combines the advantages of low-cost ownership of capillary underfills and the fast-cure of UV adhesives, but can be cured at room temperature.
120
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UF 88UL
below -20 °C
Super-fast flow capillary underfill that is able to flow into a 10μ gap at room temperature without preheating
135
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UF 120HA
- 40°C.
Highly filled, high purity liquid epoxy underfill that can flow into narrow gaps
120
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UF 120LA
-40°C.
Highly filled, high purity liquid epoxy underfill that can flow into narrow gaps
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UF 158A2
-40°C.
Rapid cure liquid epoxy Underfill encapsulant with high thermal conductivity
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UF 158A3
-40°C.
Rapid cure liquid epoxy Underfill encapsulant with high thermal conductivity
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
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