hero image product pagedie attach materail imageoptoelectronics imagewafer level materail imagethermal interface iamgeconformal coating image

Advanced Materials Driving Next-Gen Semiconductors

Sort by:
Filters
Filter
Close
Category
1 selected
Industry
1 selected
Application Method
1 selected
Medium
1 selected
Cure Temperature Range
-40
°C
250
°C
Cure Method
1 selected
Performance Focus
1 selected
All Products
TM 230
Rapid cure, self-filling, self-leveling, and self-soldering adhesive
230
Dispensing
Automotive Electronics
Aviation
Consumer Electronics
Defense
Medical Devices
Telecommunications
Solar Energy
TM 230D
Rapid cure, self-filling, self-leveling, and self-soldering adhesive
Dispensing
Automotive Electronics
Aviation
Consumer Electronics
Defense
Medical Devices
Solar Energy
Telecommunications
UF 66L
below -20 °C
One-part, solid, dual-cure, UV opitcal underfill
120
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UF 88UL
below -20 °C
Super-fast flow capillary underfill that is able to flow into a 10μ gap at room temperature without preheating
135
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UF 120HA
- 40°C.
Highly filled, high purity liquid epoxy underfill that can flow into narrow gaps
120
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UF 120LA
-40°C.
Highly filled, high purity liquid epoxy underfill that can flow into narrow gaps
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UF 158A2
-40°C.
Rapid cure liquid epoxy Underfill encapsulant with high thermal conductivity
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
UF 158A3
-40°C.
Rapid cure liquid epoxy Underfill encapsulant with high thermal conductivity
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
Thank you! Your submission has been received!
Oops! Something went wrong while submitting the form.
Innovation At Its Best

Engineering Materials for Micro-Chip Applications