Advanced Materials Driving Next-Gen Semiconductors

Reactive thermal grease product with very thin BLT that eliminates micro-bubbles at the rough interface

Reactive thermal grease product with very thin BLT that eliminates micro-bubbles at the rough interface

Rapid cure, self-filling, self-leveling and self-soldering adhesive

Solderable conductive adhesive that can easily fill gaps, is self-leveling, and can control the BLT

Solderable conductive adhesive that can easily fill gaps, is self-leveling, and can control the BLT

Solderable conductive adhesive that can easily fill gaps, is self-leveling, and can control the BLT

high-viscosity liquid metal formulated for TIM1, TIM1.5, and TIM2 thermal interface applications

Diamond-filled adhesive that has high thermal conductivity for high power applications where there is a serious thermal issue

Diamond-filled adhesive that has high thermal conductivity for high power applications where there is a seriouds thermal issue