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Advanced Materials Driving Next-Gen Semiconductors

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DA 90B
-10°C to -20 °C.
Solvent-free, fast cure, thermosetting Die Attach adhesive with high thermal conductivity
150
170
Dispensing
Printing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
DA 90L
-40 °C.
Highly thixotropic, solvent-free, fast cure thermosetting non-conductive adhesive
88
110
Dispensing
Printing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
DA 90UV
-40°C
One-part, 100% solid, Die Attach adhesive that cures within seconds
Dispensing
Printing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
DA 120
-40°C
Die and Lid Attach adhesive that offers a low modulus and low glass transition temperature
120
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
DA 120F
-40°C
Solvent-free, fast cure, thermosetting Die Attach adhesive with high thermal conductivity
120
Dispensing
Printing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
DA 150
-40°C
Solvent-free, fast cure, thermosetting Die Attach adhesive with high electrical conductivity
150
Dispensing
Printing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
DA 150A
-40°C
Solvent-free, fast cure, thermosetting Die Attach adhesive with high electrical conductivity
150
Dispensing
Printing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
DA 150LE
-40°C
One-part, insulating and thermosetting transparent Die Attach adhesive
150
Dispensing
Pin Transfer
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
DA 150U
One-part, insulating and thermosetting Die Attach adhesive designed for thin, void free, large chip bonding
150
Dispensing
Automotive Electronics
Aviation
Consumer Electronics
Defense
Medical Devices
Telecommunications
Solar Energy
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Engineering Materials for Micro-Chip Applications