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Advanced Materials Driving Next-Gen Semiconductors

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DA 158A3
Rapid cure, electrically insulating, liquid epoxy Die Attach and Thermal Interface material with high thermal conductivity
150
Dispensing
Automotive Electronics
Aviation
Consumer Electronics
Defense
Medical Devices
Solar Energy
Telecommunications
DA 158N
-40°C
Electrically insulative and thermally conductive Die Attach adhesive
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
DM 158NN
-40°C
Non-flow, low-temperature, fast cure, high purity liquid epoxy encapsulant
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
EB 25
Bump tip exposure agent for Wafer-Level underfill
25
Printing
Spray
Immersion
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
EMC 6
Organic/Inorganic hybrid solution designed for anti-corrosion and anti-rusting for metal surfaces
25
Dipping
Spray
Rolling
Automotive Electronics
Aviation
Consumer Electronics
Defense
Medical Devices
Telecommunications
Solar Energy
EMC 6A
Organic/Inorganic hybrid solution designed for anti-corrosion and anti-rusting for metal surfaces
25
Dipping
Spray
Rolling
Automotive Electronics
Aviation
Consumer Electronics
Defense
Medical Devices
Telecommunications
Solar Energy
EMC 25
One-part, epoxy, conductive coating that has exceptional electrical conductivity, EMI shielding and anti-static protection
25
60
Spray
Automotive Electronics
Aviation
Consumer Electronics
Defense
Medical Devices
Solar Energy
EMC 25A
One-part, epoxy, conductive coating that has exceptional electrical conductivity, EMI shielding and anti-static protection
25
60
Spray
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
EN 158B2
-40°C
Rapid-cure, fast-flow, easily reworkable combination capillary flow and encapsulant
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Solar Energy
Medical Devices
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Engineering Materials for Micro-Chip Applications