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Advanced Materials Driving Next-Gen Semiconductors

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LA 150
-40°C
Lid Attach adhesive offering a low modulus and low glass transition temperature, excellent adhesion, thermal shock and thermal resistance performance
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
LCD 66F
One-part, 100% solid, UV curable, LCD end sealant
110
Dispensing
Telecommunications
Aviation
Defense
LCD 66L
One-part, 100% solid, bio-compatible, UV curable, optical bonding adhesive
110
Dispensing
Telecommunications
Aviation
Defense
LEN 66A
One-part, 100% solid, super fast UV curable bonding adhesive
110
Dispensing
Telecommunications
Aviation
Defense
LEN 66AL
One-part, 100% solid, super fast UV curable bonding adhesive
110
Dispensing
Telecommunications
Aviation
Defense
LEN 66B
One-part, 100% solid, low temperature cure adhesive
70
75
Dispensing
Telecommunications
Aviation
Defense
Automotive Electronics
Medical Devices
Solar Energy
NC 256
0 °C or below
No-clean flux with zero residue after soldering reflow
230
260
Dipping
Dispensing
Printing
Pin Transfer
Consumer Electronics
Defense
Aviation
Telecommunications
NF 158R
-40°C
Filled fluxing liquid epoxy underfill
150
240
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
NF 160
Reflowable underfill combining soldering and underfilling processes in one step
Dispensing
Dipping
Printing
Automotive Electronics
Aviation
Consumer Electronics
Defense
Medical Devices
Solar Energy
Telecommunications
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