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Advanced Materials Driving Next-Gen Semiconductors

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NF 160L
-40°C
Low-temperature, reflowable underfill that improves drop performance and has easy reworkability
Dispensing
Dipping
Printing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
OA 66AL
One-part, 100% solid, UV curable bonding adhesive
Dispensing
Telecommunications
Aviation
Defense
OF 66B
5°C or below
One-part, 100% solid, UV curable bonding adhesive
Dispensing
Telecommunications
Aviation
Defense
OF 66C
5°C or below
One-part, 100% solid, dual cure, UV bonding adhesive
Dispensing
Telecommunications
Aviation
Defense
SMT 88U
-20°C.
Combines the advantages of fast-cure UV Adhesives and the low cost ownership of capillary underfills
88
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
SMT 88UL
-20 °C.
Super fast-flow capillary underfill that can flow into < 10μ gap at room temperature without preheating
80
110
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
SMT 138
-20 °C.
Conductive, rapid-cure, self-leveling and self-soldering adhesive
140
185
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
SMT 138E
-20°C.
Conductive, rapid-cure, self-leveling and self-soldering adhesive
140
185
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
SMT 138ED
-20 °C.
Conductive, rapid-cure, self-leveling and self-soldering adhesive
140
185
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
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