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Advanced Materials Driving Next-Gen Semiconductors

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All Products
SMT 138P
-20 °C.
Conductive, rapid-cure, self-leveling and self-soldering adhesive
140
185
Printing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
SMT 156
-40°C.
Conductive, rapid-cure, self-leveling and self-soldering adhesive
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
SMT 158HA
-40°C.
Fast flow, low temperature, slow cure and high purity liquid epoxy underfill
150
165
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
SMT 158U
-40°C.
Combination of capillary flow and no-flow underfill
150
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
SMT 256
-20 °C or below
Enhances solder joint reliability and eliminates underfill and cracking
230
260
Dipping
Dispensing
Printing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
SMT 256BC
-20 °C or below
Black version of SMT 256 for easy identification
230
260
Dipping
Dispensing
Printing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
SMT 256C
-20 °C or below
Low viscosity, easy flow for encapsulation
230
260
Dipping
Dispensing
Printing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
SMT 256ED
below -20 °C
Solderable adhesive that has an excellent drop test performance and high-temperature, Pb-free application
230
260
Dispensing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
SMT 256EP
below -20 °C
High-temperature solderable adhesive with ultra-high thermal conductivity
230
260
Printing
Consumer Electronics
Defense
Aviation
Telecommunications
Automotive Electronics
Medical Devices
Solar Energy
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